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RMCF2512FT300R - Stackpole Electronics, Inc.

Description: RES, 2512, 300 ohm, 1%, 1W

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RMCF2512FT300R - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RMCF2512FT300R - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF2512
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RMCF2512FT300R - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF2512
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RMCF2512FT300R Details

  • Manufacturer Part Number:

    RMCF2512FT300R

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    10

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    6.3 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, Plastic, 7 Inch

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    300 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

RMCF2512FT300R Frequently Asked Questions (FAQs)

  • The recommended land pattern for RMCF2512FT300R is a rectangular pad with a size of 1.3mm x 1.3mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for RMCF2512FT300R, ensure that the component is placed on a thermally conductive substrate, and provide adequate thermal vias to dissipate heat. The recommended thermal pad size is 2.5mm x 2.5mm, and the thermal resistance (Rth) is 30°C/W.
  • The moisture sensitivity level (MSL) of RMCF2512FT300R is MSL 2, which means it can withstand a maximum of 24 hours of exposure to 30°C/60% RH before soldering.
  • Yes, RMCF2512FT300R is suitable for high-frequency applications up to 1 GHz. However, it's essential to consider the component's self-resonant frequency (SRF) and ensure that it does not interfere with the operating frequency of your application.
  • To ensure the reliability of RMCF2512FT300R in a harsh environment, follow the recommended storage and handling procedures, and ensure that the component is operated within its specified temperature range (-55°C to 150°C). Additionally, consider using a conformal coating to protect the component from moisture and contaminants.

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RMCF2512FT300R Overview

Use the download button to access the RMCF2512FT300R schematic symbol, PCB footprint, and 3D model.
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RMCF2512FT300R Alternates

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Part Image RC12K301FCG Fenghua (HK) Electronics Ltd

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Part Image CR2512-FX-3000ELF Bourns Inc

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Part Image RMCS13001%R SEI Stackpole Electronics Inc

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Part Image 232276363001L YAGEO Corporation

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For a full list of alternate parts for RMCF2512FT300R, check out Findchips.com