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RMCF2512JT2R40 - Stackpole Electronics, Inc.

Description: RES, 2512, 2.4 ohm, 5%, 1W

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RMCF2512JT2R40 - Stackpole Electronics, Inc. - PCB symbol
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RMCF2512JT2R40 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - RMCF2512JT2R40
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RMCF2512JT2R40 - Stackpole Electronics, Inc. - 3D model - Resistor Chip - RMCF2512JT2R40
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RMCF2512JT2R40 Details

  • Manufacturer Part Number:

    RMCF2512JT2R40

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    6.3 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, Plastic, 7 Inch

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    2.4 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    400 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    200 V

RMCF2512JT2R40 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RMCF2512JT2R40 can be found in the Stackpole Electronics Inc. application note AN-120, which provides detailed guidelines for PCB layout and land pattern design.
  • The RMCF2512JT2R40 has a high power rating, and proper thermal management is crucial. Engineers should ensure good airflow, use thermal vias, and consider using a heat sink or thermal pad to keep the component temperature within the recommended operating range.
  • The MSL of the RMCF2512JT2R40 is MSL 3, which means it can withstand up to 168 hours of exposure to moisture before soldering. Engineers should follow proper handling and storage procedures to prevent moisture absorption.
  • The RMCF2512JT2R40 is designed to withstand moderate vibration levels, but engineers should consider additional mechanical support or potting compounds to ensure reliability in high-vibration applications.
  • The recommended soldering profile for the RMCF2512JT2R40 is a peak temperature of 260°C (500°F) for 10-15 seconds, with a ramp-up rate of 3°C/s (5.4°F/s) and a ramp-down rate of 6°C/s (10.8°F/s). Engineers should consult the datasheet and application notes for more detailed information.

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RMCF2512JT2R40 Overview

Use the download button to access the RMCF2512JT2R40 schematic symbol, PCB footprint, and 3D model.
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