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RN73C2A113RBTDF - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Height .022 INCH | Product Width .049 INCH | Product Length .079 INCH | Product Height .55 MM | Product Width 1.25 MM | Product Length 2 MM | Electrical Characteristics: Operating Voltage 100 V | Resistance Value 113 OHM | Power Rating .1 WATT | Passive Component Tolerance .1 PCT | Resistance Class Up to 1kΩ | Packaging Features: Packaging Method Taped & Reeled | Product Type Features: Element Type Thin Film | Resistor Type Precision Resis

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RN73C2A113RBTDF - TE Connectivity - PCB symbol
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PCB Footprints
RN73C2A113RBTDF - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - RN73 2A (0805)
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3D Models
RN73C2A113RBTDF - TE Connectivity - 3D model - Resistor Chip - RN73 2A (0805)
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RN73C2A113RBTDF Details

  • Manufacturer Part Number:

    RN73C2A113RBTDF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    UK

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks, 3 Days

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    14

  • Additional Feature:

    PRECISION

  • Construction:

    RECTANGULAR PACKAGE

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR

  • Physical Dimension:

    2mm x 1.25mm x .55mm

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    113 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    10 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    100 V

RN73C2A113RBTDF Frequently Asked Questions (FAQs)

  • The recommended land pattern for RN73C2A113RBTDF can be found in the TE Connectivity's application note 'Chip Resistor Land Pattern' (document number 2012171). It provides guidelines for designing a reliable and efficient land pattern for this component.
  • TE Connectivity recommends following the guidelines outlined in the 'Thermal Management of Chip Resistors' application note (document number 2012172). It provides information on thermal considerations, such as power rating, thermal impedance, and derating, to ensure reliable operation of the component.
  • According to TE Connectivity, the RN73C2A113RBTDF has a moisture sensitivity level (MSL) of 1, which means it can withstand a maximum of 30°C/60% relative humidity for 168 hours without being damaged.
  • While RN73C2A113RBTDF is a general-purpose chip resistor, it may not be suitable for high-frequency applications due to its construction and materials. For high-frequency applications, TE Connectivity recommends using their high-frequency chip resistors, such as the RN73C2A113RBTDF-HF series.
  • The RN73C2A113RBTDF is a lead-free and RoHS-compliant component, meaning it meets the requirements of the European Union's Restriction of Hazardous Substances (RoHS) directive and is free of lead and other hazardous substances.

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RN73C2A113RBTDF Overview

Use the download button to access the RN73C2A113RBTDF schematic symbol, PCB footprint, and 3D model.
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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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