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RNCF0805DTC1K30 - Stackpole Electronics, Inc.

Description: RES PREC, 1.3 Kohm, 0805, 0.5%, 50 ppm

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RNCF0805DTC1K30 - Stackpole Electronics, Inc.  - 3D model
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RNCF0805DTC1K30 Details

  • Manufacturer Part Number:

    RNCF0805DTC1K30

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    1300 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.5%

  • Working Voltage:

    150 V

RNCF0805DTC1K30 Frequently Asked Questions (FAQs)

  • The recommended soldering temperature for the RNCF0805DTC1K30 is between 250°C to 260°C for a maximum of 3 seconds.
  • The RNCF0805DTC1K30 is a general-purpose thick-film resistor and may not be suitable for high-frequency applications above 100 MHz. For high-frequency applications, consider using thin-film resistors or specialized high-frequency resistors.
  • The RNCF0805DTC1K30 has a moisture sensitivity level (MSL) of 1, which means it can be exposed to a maximum of 30°C and 60% relative humidity for 168 hours without being baked prior to reflow soldering.
  • The RNCF0805DTC1K30 has a maximum operating temperature of 155°C. While it can tolerate high temperatures, it's not recommended for continuous operation above 125°C. Derating may be necessary for high-temperature applications.
  • The recommended land pattern for the RNCF0805DTC1K30 is a rectangular pad with a minimum size of 0.8 mm x 1.2 mm, with a non-solder mask defined (NSMD) pad shape.

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RNCF0805DTC1K30 Overview

Use the download button to access the RNCF0805DTC1K30 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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