RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended.
Yes, the RNM-0505S/HP is designed to withstand high vibrations and meets the IEC 60068-2-6 standard for vibration resistance. However, it's recommended to consult with RECOM's application engineers for specific vibration profiles.
To ensure reliability in high-temperature environments, RECOM recommends derating the module's output power according to the temperature derating curve provided in the datasheet. Additionally, proper airflow and heat sinking are crucial to maintain the module's junction temperature within the recommended range.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10-22 μF, depending on the input voltage and ripple requirements. The capacitor should be placed as close as possible to the module's input pins.
Yes, multiple RNM-0505S/HP modules can be paralleled to increase the output power. However, it's essential to ensure that the modules are properly synchronized and that the output currents are balanced to prevent uneven stress on the modules.
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RNM-0505S/HP Overview
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