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RO-153.3S/H - RECOM Power

Description: Isolated Module DC DC Converter 1 Output 3.3V 303mA 13.5V - 16.5V Input -40°C ~ 85°C

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PCB Footprints
RO-153.3S/H - RECOM Power PCB footprint - Other - Other - 4-SIP Module_2025-1.1
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3D Models
RO-153.3S/H - RECOM Power  - 3D model - Other - 4-SIP Module_2025-1.1
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RO-153.3S/H Details

  • Manufacturer Part Number:

    RO-153.3S/H

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MODULE

  • Package Description:

    SMA, SIP4,.18

  • Pin Count:

    4

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • Manufacturer:

    RECOM Power GmbH

  • YTEOL:

    5.9

  • Analog IC - Other Type:

    DC-DC UNREGULATED POWER SUPPLY MODULE

  • Input Voltage-Max:

    16.5 V

  • Input Voltage-Min:

    13.5 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-XSMA-P4

  • Length:

    11.5 mm

  • Load Regulation-Max:

    20%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.303 A

  • Output Voltage-Max:

    3.465 V

  • Output Voltage-Min:

    3.135 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    SMA

  • Package Equivalence Code:

    SIP4,.18

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    10.25 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    PIN/PEG

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Total Power Output-Max:

    1 W

  • Trim/Adjustable Output:

    NO

  • Width:

    6 mm

RO-153.3S/H Frequently Asked Questions (FAQs)

  • RECOM recommends a PCB layout with a large copper area (at least 1 oz) connected to the module's thermal pad, and a minimum of 10 vias to dissipate heat effectively.
  • Yes, the RO-153.3S/H is designed to withstand vibrations up to 10G (sinusoidal) and 5G (random) according to IEC 60068-2-6, making it suitable for use in high-vibration environments.
  • To ensure reliability, RECOM recommends derating the output power by 2.5% per °C above 40°C, and using a suitable heat sink or thermal interface material to maintain a junction temperature below 125°C.
  • RECOM recommends using a low-ESR ceramic capacitor (X7R or X5R dielectric) with a value of 10-22 μF, and a voltage rating of at least 50V, placed as close as possible to the module's input pins.
  • Yes, the RO-153.3S/H can be used in redundant or parallel configurations, but RECOM recommends consulting their application notes and performing thorough testing to ensure reliable operation and avoid potential issues.

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RO-153.3S/H Overview

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