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ROF-78E3.3-0.5SMD-R - RECOM Power

Description: RECOM POWER - ROF-78E3.3-0.5SMD-R - DC/DC CONVERTER, 1.65W, 3.3V, 0.5A Non Isolated Power Module

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PCB Footprints
ROF-78E3.3-0.5SMD-R - RECOM Power PCB footprint - Other - Other - ROF-78E
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3D Models
ROF-78E3.3-0.5SMD-R - RECOM Power  - 3D model - Other - ROF-78E
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ROF-78E3.3-0.5SMD-R Details

  • Manufacturer Part Number:

    ROF-78E3.3-0.5SMD-R

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DMA,

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • Manufacturer:

    RECOM Power GmbH

  • YTEOL:

    6

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Approvals:

    EAC, EN

  • Efficiency (Main Output):

    84%

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    R-XDMA-N4

  • Length:

    13.5 mm

  • Line Regulation-Max:

    1%

  • Load Regulation-Max:

    3%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.5 A

  • Output Voltage-Max:

    3.465 V

  • Output Voltage-Min:

    3.135 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    250

  • Protections:

    SHORT CIRCUIT; OUTPUT OVERCURRENT

  • Ripple Voltage (Main Out):

    0.03535 Vrms

  • Seated Height-Max:

    4.5 mm

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Total Power Output-Max:

    1.65 W

  • Trim/Adjustable Output:

    NO

  • Width:

    12.5 mm

ROF-78E3.3-0.5SMD-R Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the module on a copper plane with a minimum size of 10mm x 10mm, and ensuring good thermal conductivity between the module and the PCB.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the thermal stress on the module.
  • The maximum allowed voltage derating for this module is 10% of the nominal input voltage. Exceeding this limit may affect the module's reliability and performance.
  • While the module is designed to operate in a wide range of temperatures and humidity levels, it's recommended to take precautions to prevent moisture ingress. Apply a conformal coating to the module and ensure good ventilation in the enclosure.
  • To troubleshoot issues with the module's output voltage, check the input voltage, output load, and ambient temperature. Verify that the module is properly soldered and that there are no signs of physical damage or overheating.

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ROF-78E3.3-0.5SMD-R Overview

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