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RP08-11005SAW - RECOM Power

Description: Isolated DC/DC Converters 8W DC/DC 1.6kV REG 43-160Vin 5Vout

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PCB Footprints
RP08-11005SAW - RECOM Power PCB footprint - Other - Other - RP08-11005SAW-2
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3D Models
RP08-11005SAW - RECOM Power  - 3D model - Other - RP08-11005SAW-2
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RP08-11005SAW Details

  • Manufacturer Part Number:

    RP08-11005SAW

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    DIP, DIP9/24,.6

  • Pin Count:

    24/9

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • Manufacturer:

    RECOM Power GmbH

  • YTEOL:

    6

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Input Voltage-Max:

    160 V

  • Input Voltage-Min:

    43 V

  • Input Voltage-Nom:

    110 V

  • JESD-30 Code:

    R-PDMA-P9

  • Length:

    31.8 mm

  • Load Regulation-Max:

    0.5%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    78 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.6 A

  • Output Voltage-Max:

    5.05 V

  • Output Voltage-Min:

    4.95 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP9/24,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    255

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    OTHER

  • Terminal Form:

    PIN/PEG

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    5

  • Total Power Output-Max:

    8 W

  • Trim/Adjustable Output:

    NO

  • Width:

    20.3 mm

RP08-11005SAW Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the module on a multi-layer PCB with a large copper area for heat dissipation. The copper area should be connected to a solid ground plane to ensure good heat conduction.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C. Apply a small amount of solder paste to the PCB pads and place the module on top. Use a gentle pushing force to ensure good contact. Inspect the solder joints for any signs of cold solder or bridging.
  • The recommended input capacitor value is 10uF to 22uF, with a voltage rating of 50V or higher. A low-ESR ceramic capacitor, such as an X7R or X5R type, is recommended for optimal performance.
  • To protect the module from overvoltage and undervoltage conditions, use a voltage supervisor or a voltage monitor IC to monitor the input voltage. The voltage supervisor can be set to trigger an interrupt or reset the system if the input voltage exceeds the recommended range.
  • The recommended output capacitor value is 10uF to 22uF, with a voltage rating of 10V or higher. A low-ESR ceramic capacitor, such as an X7R or X5R type, is recommended for optimal performance.

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