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RP509Z331B-E2-F - Nisshinbo

Description: 0.5A/1A 6MHz PWM/VFM Step-down DCDC Converter with Synchronous Rectifier

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RP509Z331B-E2-F - Nisshinbo PCB footprint - BGA - BGA - WLCSP-6-P6 Package
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3D Models
RP509Z331B-E2-F - Nisshinbo  - 3D model - BGA - WLCSP-6-P6 Package
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RP509Z331B-E2-F Details

  • Manufacturer Part Number:

    RP509Z331B-E2-F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    WLCSP-6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nisshinbo Micro Devices

  • YTEOL:

    8

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.3 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    R-XBGA-B6

  • Length:

    1.28 mm

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1.6 A

  • Output Voltage-Max:

    3.349 V

  • Output Voltage-Min:

    3.251 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA6,2X3,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Seated Height-Max:

    0.69 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    7200 kHz

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Width:

    0.88 mm

RP509Z331B-E2-F Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern can be found in the manufacturer's application note or layout guide, which provides detailed guidelines for optimal performance and thermal management.
  • To ensure reliability and longevity, follow the recommended operating temperature range, use a suitable thermal management system, and implement proper derating and stress analysis in your design.
  • The device requires standard ESD protection precautions, such as using an ESD wrist strap, mat, or workstation, and handling the device by the body or pins to prevent damage.
  • The device is designed to withstand standard vibration and shock levels, but for extreme environments, consult the manufacturer's reliability report or perform custom testing to ensure the device meets your specific requirements.
  • Use a combination of datasheet information, application notes, and manufacturer-provided tools and resources, such as simulation models and evaluation boards, to troubleshoot and debug issues.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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RP509Z331B-E2-F Overview

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