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RP60-2412SG - RECOM Power

Description: Recom 60W Isolated DC-DC Converter, Vin 18 → 36 V dc, Vout 12V dc, I/O isolation 1600V dc

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PCB Footprints
RP60-2412SG - RECOM Power PCB footprint - Other - Other - RP60-2412SG-1
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3D Models
RP60-2412SG - RECOM Power  - 3D model - Other - RP60-2412SG-1
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RP60-2412SG Details

  • Manufacturer Part Number:

    RP60-2412SG

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MODULE

  • Package Description:

    DMA, MODULE,8LEAD,1.8

  • Pin Count:

    8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • Manufacturer:

    RECOM Power GmbH

  • YTEOL:

    7

  • Additional Feature:

    SEATED HGT-NOM

  • Analog IC - Other Type:

    DC-DC REGULATED POWER SUPPLY MODULE

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    18 V

  • Input Voltage-Nom:

    24 V

  • JESD-30 Code:

    S-XDMA-P8

  • Length:

    50.8 mm

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    40 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    5 A

  • Output Voltage-Max:

    13.2 V

  • Output Voltage-Min:

    10.8 V

  • Output Voltage-Nom:

    12 V

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DMA

  • Package Equivalence Code:

    MODULE,8LEAD,1.8

  • Package Shape:

    SQUARE

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Peak Reflow Temperature (Cel):

    255

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    10.2 mm

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    OTHER

  • Terminal Form:

    PIN/PEG

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    5

  • Total Power Output-Max:

    60 W

  • Trim/Adjustable Output:

    YES

  • Width:

    50.8 mm

RP60-2412SG Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing the module on a multi-layer PCB with a large copper area for heat dissipation. The copper area should be connected to a solid ground plane to ensure good heat conduction.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C. Apply a small amount of solder paste to the PCB pads and place the module on the PCB. Use a reflow oven or a hot air gun to solder the module. Avoid overheating the module or using excessive force, which can damage the internal components.
  • The recommended input capacitor value is 10uF to 22uF, with a voltage rating of 50V or higher. A low-ESR ceramic capacitor, such as an X7R or X5R type, is recommended for optimal performance.
  • To protect the module from overvoltage and undervoltage conditions, use a voltage supervisor or a voltage monitor IC to monitor the input voltage. The voltage supervisor can be set to trigger an interrupt or reset the system if the input voltage exceeds the recommended range.
  • The maximum allowed input voltage ripple for this module is 10% of the nominal input voltage. Exceeding this limit may affect the module's performance and reliability.

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RP60-2412SG Overview

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