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RPC1210JT10R0 - Stackpole Electronics, Inc.

Description: RES, PULSE, 1210, 10 ohm, 5%, 0.5W

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RPC1210JT10R0 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RPC1210JT10R0 - Stackpole Electronics, Inc. PCB footprint - Resistor Chip - Resistor Chip - **RPC1210-40
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3D Models
RPC1210JT10R0 - Stackpole Electronics, Inc. - 3D model - Resistor Chip - **RPC1210-40
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RPC1210JT10R0 Details

  • Manufacturer Part Number:

    RPC1210JT10R0

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    12

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.6 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    10 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    200 V

RPC1210JT10R0 Frequently Asked Questions (FAQs)

  • The recommended land pattern for RPC1210JT10R0 is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • Yes, RPC1210JT10R0 is suitable for high-frequency applications up to 1 GHz. However, it's essential to consider the parasitic inductance and capacitance of the component and the PCB layout to ensure optimal performance.
  • The thermal resistance of RPC1210JT10R0 is approximately 30°C/W. This value is based on the component's thermal impedance and is dependent on the PCB layout, airflow, and other environmental factors.
  • Yes, RPC1210JT10R0 is compatible with lead-free soldering processes. The component is RoHS-compliant and can withstand the higher temperatures associated with lead-free soldering.
  • The recommended storage condition for RPC1210JT10R0 is in a dry, cool place with a temperature range of 10°C to 30°C and a relative humidity of 60% or less. The component should be stored in its original packaging or a similar ESD-protective package.

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RPC1210JT10R0 Overview

Use the download button to access the RPC1210JT10R0 schematic symbol, PCB footprint, and 3D model.
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