RPI-1133 footprint, schematic symbol and 3D model by ROHM Semiconductor

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RPI-1133 Details

A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces as short as possible and avoid routing them near noise sources.
Use a low-ESR capacitor (e.g., 10uF) between VIN and GND, and a 1uF capacitor between VOUT and GND. Ensure the input voltage is within the recommended range (2.5V to 5.5V) and use a low-dropout linear regulator if necessary.
The maximum output current of RPI-1133 is 1A. However, it's recommended to limit the output current to 0.8A for optimal performance and to prevent overheating.
The output voltage can be adjusted by connecting a resistor divider network between VOUT and GND. The recommended resistor values are R1 = 10kΩ and R2 = 2.2kΩ for a 3.3V output.
The thermal derating of RPI-1133 is 6.25mW/°C above 25°C. Ensure proper heat sinking and thermal management to prevent overheating.

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