ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure stable output voltage regulation, it's essential to follow the recommended input and output capacitor values, as well as the PCB layout guidelines. Additionally, the input voltage should be within the recommended range, and the output load should be within the specified current rating.
The maximum junction temperature (Tj) for RPM7138-R is 150°C. Operating the device above this temperature can reduce its lifespan and affect its performance.
While RPM7138-R can operate up to 150°C, it's not recommended for use in extremely high-temperature environments (above 125°C) without proper heat sinking and thermal management. Consult ROHM's application notes for guidance on high-temperature operation.
Power dissipation (PD) can be calculated using the formula: PD = (VIN - VOUT) x IOUT + (VIN x IQ), where VIN is the input voltage, VOUT is the output voltage, IOUT is the output current, and IQ is the quiescent current. Consult the datasheet for specific values and calculations.
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RPM7138-R Overview
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