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RR121-1B13-312 - Coto Technology

Description: COTO TECHNOLOGY - RR121-1B13-312 - TMR SENSOR, OMNIPOLAR, 3.6V, LGA-3

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PCB Footprints
RR121-1B13-312 - Coto Technology PCB footprint - Other - Other - RR121-1B13-312-3
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RR121-1B13-312 - Coto Technology  - 3D model - Other - RR121-1B13-312-3
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RR121-1B13-312 Details

  • Manufacturer Part Number:

    RR121-1B13-312

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Manufacturer:

    Coto Technology USA

  • YTEOL:

    0

  • Body Breadth:

    1.4 mm

  • Body Height:

    0.436 mm

  • Body Length or Diameter:

    1.4 mm

  • Hysteresis:

    0.5 mT

  • Magnetic Field Range-Max:

    3.8 mT

  • Magnetic Field Range-Min:

    1.8 mT

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Current-Max:

    0.0007 mA

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Range:

    0.30-2.70V

  • Output Type:

    DIGITAL VOLTAGE

  • Package Shape/Style:

    SQUARE

  • Sensors/Transducers Type:

    MAGNETIC FIELD SENSOR,MAGNETORESISTIVE

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.7 V

  • Surface Mount:

    YES

  • Termination Type:

    SOLDER

RR121-1B13-312 Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern can be found in the Coto Technology application note AN-13, which provides guidelines for optimal PCB design and assembly.
  • To ensure reliable switching performance, consider using a relay socket or a relay with a built-in vibration-resistant design. Additionally, follow proper PCB mounting and screwing procedures to minimize mechanical stress on the relay.
  • The maximum allowable voltage drop across the relay contacts is typically 100 mV. Exceeding this value may lead to premature contact wear or relay failure.
  • The RR121-1B13-312 is rated for operation up to 85°C. For high-temperature applications, consider using a relay with a higher temperature rating or consulting with Coto Technology's application engineers for custom solutions.
  • To minimize EMI, use proper shielding, grounding, and layout techniques. Consider using a relay with built-in EMI shielding or adding external shielding to the PCB design.

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RR121-1B13-312 Overview

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