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RS1G150MNTB - ROHM Semiconductor

Description: Nch Power MOSFET, VDSS 40V, RDS(on)(Max.) 10.6mΩ, ID ±43A, PD 25W HSOP8

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RS1G150MNTB - ROHM Semiconductor PCB footprint - Other - Other - RS1G150MNTB
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RS1G150MNTB - ROHM Semiconductor  - 3D model - Other - RS1G150MNTB
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RS1G150MNTB Details

  • Manufacturer Part Number:

    RS1G150MNTB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HSOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    0

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    15 A

  • Drain-source On Resistance-Max:

    0.0133 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    3 W

  • Pulsed Drain Current-Max (IDM):

    60 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RS1G150MNTB Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the IC, and a 2-layer or 4-layer PCB with a thermal relief pattern is suggested to improve heat dissipation.
  • Use a capacitor with a low ESR (Equivalent Series Resistance) and ensure the capacitor is placed close to the IC to minimize parasitic inductance.
  • A 10uF to 22uF ceramic capacitor with an X5R or X7R dielectric is recommended for input decoupling, placed as close to the IC as possible.
  • Use a voltage supervisor or a power-on reset circuit to monitor the input voltage and reset the IC during abnormal voltage conditions.
  • The maximum power dissipation is dependent on the ambient temperature and PCB design. A thermal analysis or simulation is recommended to determine the maximum allowable power dissipation.

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RS1G150MNTB Overview

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