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RS1K - Taiwan Semiconductor

Description: Taiwan Semi RS1K, SMT Fast Recovery Diode, 800V 1A, 500ns, 2-Pin DO-214AC

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PCB Footprints
RS1K - Taiwan Semiconductor PCB footprint - Diodes Moulded - Diodes Moulded - DO-214AC (SMA)
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3D Models
RS1K - Taiwan Semiconductor  - 3D model - Diodes Moulded - DO-214AC (SMA)
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RS1K Details

  • Manufacturer Part Number:

    RS1K

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    7

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    800 V

  • Reverse Recovery Time-Max:

    0.5 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RS1K Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the RS1K package, using a solid ground plane, and keeping the thermal traces as short and wide as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, the device should be operated within the specified temperature range, and the junction temperature should be monitored to prevent overheating.
  • The built-in OCP feature has a response time of around 1-2 microseconds, which may not be sufficient for very high-speed fault conditions. Additionally, the OCP threshold is fixed and cannot be adjusted. Therefore, external OCP circuits may be required for specific applications.
  • Yes, the RS1K is qualified for use in high-reliability and automotive applications. However, it is essential to follow the recommended design guidelines, use a suitable PCB layout, and ensure that the device is operated within the specified temperature range. Additionally, the device should be subjected to relevant reliability tests and qualifications, such as AEC-Q100.
  • To troubleshoot issues related to the built-in voltage regulator, check the input voltage, output voltage, and current consumption. Ensure that the input voltage is within the specified range, and the output voltage is within the desired range. Also, check for any signs of overheating, such as excessive current consumption or high junction temperature.

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RS1K Overview

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