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RS1K - onsemi

Description: For surface mounted applications. ; Glass passivated junction. ; Built in strain relief, ideal for automated placement.

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Symbol
RS1K - onsemi - PCB symbol
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PCB Footprints
RS1K - onsemi PCB footprint - Diodes Moulded - Diodes Moulded - DO-214AC_
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3D Models
RS1K - onsemi - 3D model - Diodes Moulded - DO-214AC_
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RS1K Details

  • Manufacturer Part Number:

    RS1K

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SMA

  • Package Description:

    SMA, 2 PIN

  • Manufacturer Package Code:

    403AE

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Application:

    FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1.19 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    800 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.5 µs

  • Reverse Test Voltage:

    800 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RS1K Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the package to connect the thermal pad to the copper area.
  • The RS1K is rated for operation up to 150°C. To ensure reliable operation, the device should be derated according to the datasheet, and the PCB should be designed to minimize thermal resistance. A heat sink or thermal interface material may be necessary for high-temperature applications.
  • A gate drive circuit with a high current capability (e.g., 1A) and a fast rise time (e.g., 10ns) is recommended. The gate drive voltage should be set to 15V to ensure proper switching. A gate resistor value of 10-20 ohms is typical.
  • A TVS diode or a zener diode can be used to protect the RS1K from overvoltage conditions. A fuse or a current sense resistor can be used to detect overcurrent conditions. A supervisory IC can also be used to monitor the device's operating conditions and provide protection.
  • A dead time of 100-200ns is recommended to ensure proper switching and to prevent shoot-through currents. The dead time should be adjusted based on the specific application and operating conditions.

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RS1K Overview

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RS1K Alternates

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Image Part Number Model
Part Image RS1K Taiwan Semiconductor

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Part Image RGF1K General Instrument Corp

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Part Image RS1K-T3 Sangdest Microelectronics (Nanjing) Co Ltd

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Part Image RS1K-F Sangdest Microelectronics (Nanjing) Co Ltd

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Part Image RS1K-7 Diodes Incorporated

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For a full list of alternate parts for RS1K, check out Findchips.com