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RS1KFA - onsemi

Description: High Surge Capacity; MSL 1 per J-STD-020; UL Flammability 94V-0 Classification; RoHS Compliant / Green Molding Compound; Low Forward Voltage: 1.3 V Maximum; Fast Switching for High Efficiency; Glass Passivated Chip Junction; NRVHP Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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PCB Footprints
RS1KFA - onsemi PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD−123FA CASE 425AB ISSUE A
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RS1KFA - onsemi  - 3D model - Small Outline Diode Flat Lead - SOD−123FA CASE 425AB ISSUE A
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RS1KFA Details

  • Manufacturer Part Number:

    RS1KFA

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD-123 FL

  • Manufacturer Package Code:

    425AB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.15

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.8 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    800 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.5 µs

  • Reverse Test Voltage:

    800 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RS1KFA Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and keeping the thermal path as short as possible. A 4-layer PCB with a dedicated thermal layer is also recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, derating the device's power dissipation and using a heat sink can help reduce the junction temperature.
  • The maximum allowed voltage on the gate pin is ±20V, but it's recommended to keep it within ±15V to ensure reliable operation and prevent damage to the device.
  • To protect the device from ESD, it's essential to follow proper handling and storage procedures, use ESD-safe materials and tools, and implement ESD protection circuits in the design. Additionally, using a device with built-in ESD protection, such as the RS1KFA, can help reduce the risk of ESD damage.
  • The recommended gate drive voltage is typically between 10V to 15V, and the recommended gate drive current is around 1A to 2A. However, the optimal gate drive voltage and current may vary depending on the specific application and switching frequency.

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RS1KFA Overview

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