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RS2105XN - RUNIC

Description: • -3dB Bandwidth: 30MHz • High Speed, Typically 50ns • Supply Range: +1.8V to +5.5V • Low ON-State Resistance, 0.5Ω(TYP) • Break-Before-Make Switching • Rail-to-Rail Operation • TTL/CMOS Compatible • Extended Industrial Temperature Range: -40°C to +125°C

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PCB Footprints
RS2105XN - RUNIC PCB footprint - Small Outline Packages - Small Outline Packages - MSOP-10
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3D Models
RS2105XN - RUNIC  - 3D model - Small Outline Packages - MSOP-10
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RS2105XN Details

  • Manufacturer Part Number:

    RS2105XN

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Contact Manufacturer

  • Package Description:

    MSOP-10

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    RUNIC

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    S-PDSO-G10

  • Length:

    3 mm

  • Normal Position:

    NO/NC

  • Number of Channels:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    68 dB

  • On-state Resistance Match-Nom:

    0.04 Ω

  • On-state Resistance-Max (Ron):

    1.7 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.5 A

  • Supply Current-Max (Isup):

    0.001 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Switching:

    BREAK-BEFORE-MAKE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3 mm

RS2105XN Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the RS2105XN involves keeping the input and output traces as short as possible, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a separate ground plane is also recommended.
  • To ensure proper thermal management, the RS2105XN should be mounted on a heat sink with a thermal conductivity of at least 1 W/m-K. The heat sink should be attached using a thermal interface material with a thermal conductivity of at least 5 W/m-K. Additionally, the device should be placed in a well-ventilated area to prevent overheating.
  • The maximum allowed voltage on the enable pin (EN) of the RS2105XN is 6V. Exceeding this voltage may damage the device. It is recommended to use a voltage limiter or a voltage divider to ensure the enable pin voltage does not exceed 6V.
  • The RS2105XN is designed for general-purpose applications and is not intended for high-reliability or high-temperature applications. For such applications, a more specialized device with a higher temperature rating and more stringent quality control should be used.
  • To troubleshoot issues with the RS2105XN, start by checking the input voltage, output current, and temperature. Verify that the device is properly mounted on a heat sink and that the thermal interface material is properly applied. Check for any signs of physical damage or contamination. If the issue persists, consult the datasheet and application notes for further guidance or contact RUNIC technical support.

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