RECOM Power Inc recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
Yes, the RS3-2405SZ/H3 is designed to withstand high vibrations. It is built with a ruggedized design and has undergone rigorous vibration testing according to IEC 60068-2-6. However, it's recommended to consult with RECOM Power Inc for specific vibration requirements and to ensure the module is properly mounted and secured.
The derating curve for the RS3-2405SZ/H3 is not explicitly stated in the datasheet, but RECOM Power Inc provides a derating curve in their application notes. The curve shows the recommended output power reduction as a function of ambient temperature to ensure reliable operation and prevent overheating.
Yes, the RS3-2405SZ/H3 can be paralleled to increase the output power. However, it's essential to ensure that the modules are identical, and the output voltages are matched to within 1% to prevent current imbalance. Additionally, the user should consult with RECOM Power Inc for specific guidance on paralleling multiple modules.
The MTBF of the RS3-2405SZ/H3 is not explicitly stated in the datasheet, but RECOM Power Inc provides an MTBF calculation based on the Telcordia SR-332 Issue 4 method. The calculated MTBF is typically in the range of 1-2 million hours, depending on the operating conditions.
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