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RS3B - Taiwan Semiconductor

Description: Taiwan Semi RS3B, SMT Fast Recovery Diode, 100V 3A, 150ns, 2-Pin DO-214AB • For surface mounted application • Glass passivated junction chip • Built-in strain relief, ideal for automated placement • Fast switching for high efficiency • High temperature soldering : 260°C/10 seconds at terminals

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RS3B - Taiwan Semiconductor - PCB symbol
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PCB Footprints
RS3B - Taiwan Semiconductor PCB footprint - Diodes Moulded - Diodes Moulded - RS3B
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3D Models
RS3B - Taiwan Semiconductor - 3D model - Diodes Moulded - RS3B
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RS3B Details

  • Manufacturer Part Number:

    RS3B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    6

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Recovery Time-Max:

    0.15 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RS3B Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal traces as short and wide as possible. Additionally, it's recommended to use a thermal pad on the bottom of the package to improve heat dissipation.
  • The RS3B requires a specific power sequencing order to prevent damage to the device. The recommended power-up sequence is VDDIO, VDD, and then VREF. The power-down sequence should be reversed. It's also important to ensure that the voltage difference between VDD and VDDIO does not exceed 0.5V during power-up or power-down.
  • The built-in voltage regulator of the RS3B has limitations on its output current and voltage range. The maximum output current is 50mA, and the output voltage range is 1.2V to 3.3V. Additionally, the voltage regulator may not be suitable for applications that require a high level of precision or low noise.
  • A reliable reset circuit for the RS3B can be implemented using a voltage supervisor IC or a discrete reset circuit with a capacitor and a resistor. The reset circuit should be designed to ensure that the reset signal is asserted for a minimum of 10ms to guarantee a proper reset of the device.
  • When designing with the RS3B, it's essential to consider EMI and ESD protection to ensure the reliability and robustness of the system. This can be achieved by using EMI filters, shielding, and ESD protection devices such as TVS diodes or ESD arrays. Additionally, following good PCB design practices, such as minimizing trace lengths and using a solid ground plane, can also help reduce EMI and ESD risks.

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