RS3E-2424S/H3 - RECOM Power

RS3E-2424S/H3 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
• Can I use this module in a high-vibration environment?
  Yes, the RS3E-2424S/H3 is designed to withstand high vibrations. It meets the IEC 60068-2-6 vibration test standard, which involves sinusoidal vibration at 10-2000 Hz, 2G amplitude, and 3 axes. However, it's recommended to consult with RECOM's application engineers to ensure the module meets the specific vibration requirements of your application.
• How do I ensure the module's reliability in high-temperature environments?
  To ensure reliability in high-temperature environments, RECOM recommends following the derating curves provided in the datasheet. Additionally, it's essential to ensure good airflow around the module, and to avoid exceeding the maximum operating temperature of 85°C. It's also recommended to consider using a heat sink or thermal interface material to improve heat dissipation.
• What is the recommended input capacitor configuration for this module?
  RECOM recommends using a low-ESR input capacitor with a minimum capacitance of 10uF and a voltage rating of at least 25V. The capacitor should be placed as close as possible to the module's input pins to minimize noise and ensure stable operation.
• Can I use this module in a redundant or parallel configuration?
  Yes, the RS3E-2424S/H3 can be used in a redundant or parallel configuration to achieve higher power output or to improve system reliability. However, it's essential to consult with RECOM's application engineers to ensure the modules are properly configured and synchronized to avoid any potential issues.