ROHM recommends a thermal pad size of 2.5mm x 2.5mm with a minimum of 10 thermal vias (0.3mm diameter) to ensure efficient heat dissipation. Additionally, a solid copper plane on the bottom layer can help to further reduce thermal resistance.
To ensure SOA, monitor the device's voltage, current, and temperature. ROHM provides a SOA graph in the datasheet, which can be used to determine the safe operating region. Additionally, consider using overcurrent protection, undervoltage lockout, and thermal monitoring to prevent damage.
ROHM recommends using a low-ESR ceramic capacitor (X5R or X7R dielectric) with a value of 4.7uF to 10uF, depending on the specific application requirements. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
The EN pin should be pulled low during power-up and power-down sequences to prevent unwanted switching. ROHM recommends using a pull-down resistor (e.g., 10kΩ) and a capacitor (e.g., 100nF) in series to filter out noise and ensure a clean enable signal.
The maximum allowed voltage on the EN pin is 6V, which is the absolute maximum rating. However, to ensure reliable operation, ROHM recommends keeping the EN pin voltage below 5.5V.
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