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RS3J-E3/9AT - Vishay

Description: • Low profile package • Ideal for automated placement • Glass passivated pellet chip junction • Fast switching for high efficiency • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C • AEC-Q101 qualified available - Automotive ordering code: base P/NHE3 or P/NHM3 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912

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PCB Footprints
RS3J-E3/9AT - Vishay PCB footprint - Diodes Moulded - Diodes Moulded - SMC (DO-214AB)
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3D Models
RS3J-E3/9AT - Vishay  - 3D model - Diodes Moulded - SMC (DO-214AB)
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RS3J-E3/9AT Details

  • Manufacturer Part Number:

    RS3J-E3/9AT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMC, 2 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    5 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    600 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    10 µA

  • Reverse Recovery Time-Max:

    0.25 µs

  • Reverse Test Voltage:

    600 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RS3J-E3/9AT Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the RS3J-E3/9AT is a rectangular pad with dimensions of 3.3 mm x 1.4 mm, with a 0.5 mm radius corner and a 0.2 mm spacing between pads.
  • While the RS3J-E3/9AT is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum power rating at elevated temperatures. Consult the datasheet and application notes for more information.
  • To ensure reliable soldering, follow the recommended soldering profile, use a solder with a melting point below 260°C, and avoid applying excessive force or vibration during the soldering process.
  • Yes, the RS3J-E3/9AT is compatible with lead-free soldering processes, but it's essential to follow the recommended soldering profile and use a lead-free solder with a melting point below 260°C.
  • The typical failure mode of the RS3J-E3/9AT is thermal runaway, which can occur due to excessive power dissipation, high ambient temperatures, or poor thermal management. Ensure proper thermal design and follow the recommended power rating to minimize the risk of failure.

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RS3J-E3/9AT Overview

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