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RS3M-13-F - Diodes Incorporated

Description: Diodes Inc RS3M-13-F Switching Diode, 3A 1000V, 2-Pin SMC

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RS3M-13-F - Diodes Incorporated - PCB symbol
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PCB Footprints
RS3M-13-F - Diodes Incorporated PCB footprint - Diodes Moulded - Diodes Moulded - SMC
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3D Models
RS3M-13-F - Diodes Incorporated - 3D model - Diodes Moulded - SMC
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RS3M-13-F Details

  • Manufacturer Part Number:

    RS3M-13-F

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN, PLASTIC, SMC, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SMC

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Application:

    EFFICIENCY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    100 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Recovery Time-Max:

    0.5 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

RS3M-13-F Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the RS3M-13-F is a standard SOT23 package with a 1.3mm x 1.3mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the maximum junction temperature (Tj) by 1°C for every 1W of power dissipation above 25°C. Additionally, ensure good thermal design and heat dissipation on the PCB.
  • The maximum allowable voltage for the RS3M-13-F is 20V. Exceeding this voltage may cause permanent damage to the device.
  • The RS3M-13-F has built-in ESD protection, but it is still recommended to follow standard ESD handling precautions when handling the device, such as using an ESD wrist strap or mat, and storing the device in an anti-static bag.
  • The recommended storage condition for the RS3M-13-F is in a dry, cool place with a temperature range of -40°C to 125°C and relative humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.

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RS3M-13-F Overview

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