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RS3MB-T - Taiwan Semiconductor

Description: Rectifiers 500ns, 3A, 1000V, Fast Recovery Rectifier

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PCB Footprints
RS3MB-T - Taiwan Semiconductor PCB footprint - Diodes Moulded - Diodes Moulded - DO-214AA (SMB)
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3D Models
RS3MB-T - Taiwan Semiconductor  - 3D model - Diodes Moulded - DO-214AA (SMB)
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RS3MB-T Details

  • Manufacturer Part Number:

    RS3MB-T

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    6

  • Application:

    FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.3 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    80 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.5 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

RS3MB-T Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern around the thermal pad are suggested. Additionally, a solid ground plane on the bottom layer can help to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and storage temperature (Tstg). Also, consider using a heat sink or thermal interface material to reduce the junction-to-ambient thermal resistance (RθJA).
  • The RS3MB-T has built-in ESD protection diodes, but it's still recommended to follow proper ESD handling procedures during assembly and testing. For latch-up prevention, ensure that the device is operated within the recommended voltage and current ranges, and avoid applying voltage or current pulses that exceed the maximum ratings.
  • While the RS3MB-T is a general-purpose device, it may not meet the specific requirements for high-reliability or automotive applications. It's essential to review the device's qualification and certification status, as well as its performance under extreme conditions, before using it in such applications.
  • The recommended soldering conditions for the RS3MB-T include a peak temperature of 260°C, a soldering time of 10 seconds or less, and a soldering method that minimizes thermal shock. It's also important to follow the recommended soldering profile and use a solder with a melting point above 217°C.

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