ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Use a soldering iron with a temperature of 350°C (662°F) or less, and a solder with a melting point of 220°C (428°F) or higher. Apply a small amount of solder paste to the thermal pad and reflow according to the recommended soldering profile.
The maximum allowed voltage for the RSB12WFHTL is 12V, but it's recommended to operate within the specified voltage range of 7V to 10V for optimal performance and reliability.
The RSB12WFHTL is rated for operation up to 150°C (302°F), but derating is required for temperatures above 125°C (257°F). Consult the datasheet for specific derating guidelines.
Use the formula: Pd = (Vin - Vout) x Iout, where Pd is the power dissipation, Vin is the input voltage, Vout is the output voltage, and Iout is the output current. Ensure the calculated power dissipation is within the specified maximum rating.
Trust Checks
No trust score is available for this model.
Trust Score Unavailable
Sponsored
RSB12WFHTL Overview
Use the download button to access the RSB12WFHTL 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like RSB12,
or try a keyword search, such as Transient Suppressors
