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RSD050N10TL - ROHM Semiconductor

Description: 4V Drive Nch MOSFET: Power MOSFETs are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications.Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

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RSD050N10TL - ROHM Semiconductor - PCB symbol
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PCB Footprints
RSD050N10TL - ROHM Semiconductor PCB footprint - Other - Other - CPT3
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3D Models
RSD050N10TL - ROHM Semiconductor - 3D model - Other - CPT3
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RSD050N10TL Details

  • Manufacturer Part Number:

    RSD050N10TL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SC-63

  • Package Description:

    CPT3, SC-63, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    2

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    5 A

  • Drain-source On Resistance-Max:

    0.205 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e2

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    15 W

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Copper (Sn/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RSD050N10TL Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the RSD050N10TL is -55°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended derating guidelines for the device, and consider using a heat sink or thermal management system to keep the junction temperature within the recommended range.
  • The recommended PCB layout and thermal design for the RSD050N10TL involves using a multi-layer PCB with a solid ground plane, placing the device near a heat sink or thermal pad, and ensuring good thermal conductivity between the device and the heat sink.
  • When handling the RSD050N10TL, it's essential to follow proper safety precautions, such as using protective equipment, ensuring a safe working distance, and following proper testing procedures to avoid electrical shock or damage to the device.
  • The recommended soldering conditions for the RSD050N10TL involve using a soldering iron with a temperature range of 350°C to 380°C, and a soldering time of 3-5 seconds.

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RSD050N10TL Overview

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