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RSF2JT1K00 - Stackpole Electronics, Inc.

Description: Lower-cost alternative to carbon comps and wirewounds • Coating meets UL 94V-0 • Meets solvent test of Mil Standard 202, Method 215 • Cut and formed product is available on select sizes - contact Stackpole • Higher or lower resistance values may be possible - contact Stackpole • Flameproof

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RSF2JT1K00 - Stackpole Electronics, Inc. - PCB symbol
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PCB Footprints
RSF2JT1K00 - Stackpole Electronics, Inc. PCB footprint - Resistors, Axial Diameter Horizontal Mounting - Resistors, Axial Diameter Horizontal Mounting - RSF2
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3D Models
RSF2JT1K00 - Stackpole Electronics, Inc. - 3D model - Resistors, Axial Diameter Horizontal Mounting - RSF2
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RSF2JT1K00 Details

  • Manufacturer Part Number:

    RSF2JT1K00

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    AXIAL LEADED

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.90

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    SEI Stackpole Electronics Inc

  • YTEOL:

    6.2

  • Additional Feature:

    FLAMEPROOF

  • Construction:

    Tubular

  • Lead Diameter:

    0.75 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    235 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Diameter:

    5.5 mm

  • Package Length:

    15 mm

  • Package Style:

    Axial

  • Packing Method:

    TR, 13.5 INCH

  • Rated Power Dissipation (P):

    2 W

  • Rated Temperature:

    70 °C

  • Resistance:

    1000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Surface Mount:

    NO

  • Technology:

    METAL OXIDE FILM

  • Terminal Finish:

    MATTE TIN

  • Terminal Shape:

    WIRE

  • Tolerance:

    5%

  • Working Voltage:

    350 V

RSF2JT1K00 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the RSF2JT1K00 is a rectangular pad with a size of 2.5mm x 1.25mm, with a 0.5mm radius corner. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • The RSF2JT1K00 has a high power rating, so thermal considerations are crucial. Ensure good airflow around the component, and consider using a heat sink or thermal interface material to reduce thermal resistance. The component's thermal pad should be connected to a large copper area on the PCB to dissipate heat efficiently.
  • The RSF2JT1K00 has an operating temperature range of -55°C to 150°C. However, the component's power rating is derated above 125°C, so ensure that the component does not exceed this temperature during operation.
  • To ensure the reliability of the RSF2JT1K00 in high-vibration environments, use a secure mounting method such as a screw-down or adhesive mounting. Additionally, consider using a component with a higher vibration rating or a vibration-dampening material to reduce the impact of vibrations on the component.
  • The recommended soldering profile for the RSF2JT1K00 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the soldering process is done in a nitrogen atmosphere to prevent oxidation.

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RSF2JT1K00 Overview

Use the download button to access the RSF2JT1K00 schematic symbol, PCB footprint, and 3D model.
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Part Image RSF2JB1K00 SEI Stackpole Electronics Inc

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