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RSFDL - Taiwan Semiconductor

Description: Glass passivated chip junction ● Ideal for automated placement ● High temperature metallurgically bonded construction ● Fast switching for high efficiency ● Moisture sensitivity level: level 1, per J-STD-020 ● RoHS Compliant ● Halogen-free according to IEC 61249-2-21

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PCB Footprints
RSFDL - Taiwan Semiconductor PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - Sub SMA
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3D Models
RSFDL - Taiwan Semiconductor  - 3D model - Small Outline Diode Flat Lead - Sub SMA
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RSFDL Details

  • Manufacturer Part Number:

    RSFDL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Taiwan Semiconductor

  • YTEOL:

    3

  • Additional Feature:

    METALLURGICALLY BONDED

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Recovery Time-Max:

    0.15 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

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RSFDL Overview

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