RECOM Power Inc recommends a PCB layout with a large copper area for heat dissipation, and a thermal via array under the module to improve thermal conductivity. A minimum of 2oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of at least 1W/mK should be used between the module and the heat sink.
To ensure reliability and longevity, it's essential to operate the module within the recommended temperature range (up to 100°C). Implementing a temperature derating scheme, using a heat sink with a high thermal conductivity, and ensuring good airflow around the module can help reduce thermal stress. Additionally, following the recommended soldering and handling procedures can help prevent damage during assembly.
The RSH2-3.33.3S/H3 module is designed to meet CISPR 22 Class B and EN 55022 Class B EMI standards. To ensure EMC compliance, it's recommended to use a metal enclosure, implement proper grounding and shielding, and follow good PCB layout practices. Additionally, the module's input and output filters should be designed to meet the specific application's EMI requirements.
Yes, the RSH2-3.33.3S/H3 module can be used in redundant or parallel configurations to achieve higher power ratings or improve system reliability. However, it's essential to ensure that the modules are properly synchronized and configured to prevent oscillations or instability. RECOM Power Inc recommends consulting their application notes and seeking guidance from their technical support team for specific implementation details.
The RSH2-3.33.3S/H3 module meets various safety certifications, including UL 60950-1, EN 60950-1, and IEC 60950-1. It's essential to follow proper safety guidelines during handling, assembly, and operation, including ensuring proper insulation, using protective devices, and following the recommended operating conditions.
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RSH2-3.33.3S/H3 Overview
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