TDK-Lambda recommends a PCB layout with a solid copper ground plane and thermal vias under the module to ensure efficient heat dissipation. A minimum of 2oz copper thickness is recommended.
Yes, the RSKN-2010 is designed to withstand vibrations up to 10G peak acceleration, but it's recommended to follow the mounting instructions and ensure the module is securely fastened to the PCB to prevent damage.
To ensure EMC, TDK-Lambda recommends following the recommended PCB layout, using a metal enclosure, and implementing proper EMI filtering and shielding. Additionally, the module meets the EN55022 Class B and FCC Part 15 Class B emissions standards.
The RSKN-2010 can tolerate an input voltage deviation of ±10% of the nominal input voltage without affecting its performance or reliability.
Yes, the RSKN-2010 can be used in a redundant configuration, but it's essential to ensure that the modules are properly synchronized and that the system is designed to handle the increased power consumption and heat generation.
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RSKN-2010 Overview
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