RSMF1JTR100 footprint, schematic symbol and 3D model by Stackpole Electronics, Inc.

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RSMF1JTR100 Details

The recommended land pattern for the RSMF1JTR100 is a rectangular pad with a size of 2.5mm x 1.25mm, with a 0.5mm radius corner and a 0.2mm solder mask clearance.
The RSMF1JTR100 has a thermal resistance of 35°C/W. To handle thermal considerations, ensure good airflow, use a heat sink if necessary, and avoid overheating the component.
The maximum operating temperature for the RSMF1JTR100 is 150°C, with a storage temperature range of -40°C to 150°C.
Yes, the RSMF1JTR100 is suitable for high-frequency applications up to 1 GHz, but ensure proper impedance matching and consider the component's self-resonant frequency.
To ensure reliability in a humid environment, apply a conformal coating to the component, use a moisture-resistant packaging, and follow proper storage and handling procedures.

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Use the download button to access the RSMF1JTR100 schematic symbol, PCB footprint, and 3D model.

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