RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad to ensure good heat dissipation. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a heat sink or a metal plate for further heat dissipation.
To ensure reliability in high-temperature environments, it is essential to follow the recommended derating curves for the module's output power and input voltage. Additionally, ensure good airflow around the module, and consider using a heat sink or a metal plate to dissipate heat.
RECOM recommends using a low-ESR ceramic capacitor with a value of 10uF to 22uF, rated for the input voltage of the module. This helps to filter out input noise and ensure stable operation.
Yes, the RSO-1212S/H3 can be used in a redundant configuration to achieve high reliability. However, it is essential to ensure that the modules are properly synchronized and that the system is designed to handle the increased power consumption and heat generation.
The typical MTBF for the RSO-1212S/H3 is >1 million hours, calculated according to MIL-HDBK-217F. However, this value can vary depending on the operating conditions and environment.
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RSO-1212S/H3 Overview
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