RECOM recommends a PCB layout with a large copper area connected to the module's thermal pad, and multiple vias to dissipate heat effectively. A minimum of 2oz copper thickness is recommended.
Yes, the RSOE-2405SZ/H2 is designed to withstand high vibrations and meets the IEC 60068-2-6 standard for vibration resistance. However, it's recommended to consult with RECOM's application engineers for specific vibration profiles and mounting recommendations.
To ensure reliability in high-temperature applications, RECOM recommends derating the module's output power according to the temperature derating curve provided in the datasheet. Additionally, ensure good airflow and a clean, dry environment to prevent moisture ingress.
RECOM recommends using a low-ESR, high-frequency ceramic capacitor (e.g., X7R or X5R) with a value of 10uF to 22uF, depending on the input voltage and ripple requirements. Consult the datasheet for specific recommendations.
Yes, the RSOE-2405SZ/H2 can be paralleled to increase the output power. However, RECOM recommends consulting with their application engineers to ensure proper synchronization, current sharing, and thermal management.
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