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RSQ045N03TR - ROHM Semiconductor

Description: ROHM RSQ045N03TR N-channel MOSFET Transistor, 4.5 A, 30 V, 3-Pin SC-95

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Symbol
RSQ045N03TR - ROHM Semiconductor - PCB symbol
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PCB Footprints
RSQ045N03TR - ROHM Semiconductor PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - TSMT6_1
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3D Models
RSQ045N03TR - ROHM Semiconductor - 3D model - SOT23 (6-Pin) - TSMT6_1
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RSQ045N03TR Details

  • Manufacturer Part Number:

    RSQ045N03TR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    TSMT6, 6 PIN

  • Pin Count:

    6

  • Similar Group:

    TR0810021002YYYY10059160

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    1

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    4.5 A

  • Drain-source On Resistance-Max:

    0.056 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.25 W

  • Pulsed Drain Current-Max (IDM):

    18 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RSQ045N03TR Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the RSQ045N03TR is -55°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended derating guidelines for the device, and consider using thermal management techniques such as heat sinks or thermal interfaces.
  • A recommended PCB layout for the RSQ045N03TR includes using a thermal pad on the bottom of the device, and connecting it to a large copper area on the PCB to dissipate heat efficiently.
  • Yes, the RSQ045N03TR is suitable for high-frequency switching applications up to 1 MHz, but it's essential to consider the device's switching characteristics, such as rise and fall times, and ensure proper PCB layout and decoupling to minimize electromagnetic interference (EMI).
  • To protect the RSQ045N03TR from ESD, it's essential to follow proper handling and storage procedures, such as using anti-static bags or containers, and ensuring that all personnel handling the device are grounded.

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RSQ045N03TR Overview

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