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RT0805BRD0739K2L - Yageo Group

Description: Thin Film Resistors - SMD 1/8W 39.2K ohm .1% 25ppm

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RT0805BRD0739K2L - Yageo Group - PCB symbol
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PCB Footprints
RT0805BRD0739K2L - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - RT0805
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RT0805BRD0739K2L - Yageo Group - 3D model - Resistor Chip - RT0805
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RT0805BRD0739K2L Details

  • Manufacturer Part Number:

    RT0805BRD0739K2L

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    14

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Resistance:

    39200 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    150 V

RT0805BRD0739K2L Frequently Asked Questions (FAQs)

  • The recommended land pattern for RT0805BRD0739K2L is a rectangular pad with a size of 0.8mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • Yes, RT0805BRD0739K2L is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating and premature failure.
  • Yes, RT0805BRD0739K2L is compatible with lead-free soldering processes, including SAC305 and Sn96.5Ag3Cu0.5. However, it's crucial to follow the recommended soldering profile to prevent damage to the component.
  • The MSL of RT0805BRD0739K2L is MSL 2, which means it can withstand exposure to moisture for up to 4 days without requiring baking before reflow soldering.
  • Yes, RT0805BRD0739K2L is designed for high-reliability applications and is suitable for use in long-lifespan systems. It has a failure rate of < 1% per 1,000 hours at 125°C, making it a reliable choice for critical systems.

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RT0805BRD0739K2L Overview

Use the download button to access the RT0805BRD0739K2L schematic symbol, PCB footprint, and 3D model.
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