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RT0805BRD07453KL - Yageo Group

Description: Thin Film Resistors - SMD 1/8W 453K ohm .1% 25ppm

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RT0805BRD07453KL - Yageo Group - PCB symbol
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PCB Footprints
RT0805BRD07453KL - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - RT0805
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RT0805BRD07453KL - Yageo Group - 3D model - Resistor Chip - RT0805
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RT0805BRD07453KL Details

  • Manufacturer Part Number:

    RT0805BRD07453KL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    14

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Resistance:

    453000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    150 V

RT0805BRD07453KL Frequently Asked Questions (FAQs)

  • The recommended land pattern for RT0805BRD07453KL is a rectangular pad with a size of 0.8mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's termination style and ensure reliable soldering.
  • RT0805BRD07453KL has a maximum operating temperature of 125°C, making it suitable for most industrial and commercial applications. However, it's essential to ensure that the component is used within its specified temperature range to maintain its performance and reliability.
  • RT0805BRD07453KL is a moisture-sensitive device (MSD) and requires proper handling and storage to prevent damage. It's recommended to store the component in a dry environment, use a dry pack or desiccant, and follow the manufacturer's recommended baking and reflow procedures.
  • The recommended soldering process for RT0805BRD07453KL is a reflow soldering process with a peak temperature of 260°C ± 5°C, and a dwell time of 30-60 seconds above 220°C. It's essential to follow the manufacturer's recommended soldering profile to ensure reliable solder joints.
  • RT0805BRD07453KL is designed to meet the requirements of most industrial and commercial applications, including those with moderate vibration and shock. However, it's essential to ensure that the component is properly secured and mounted to prevent mechanical stress and damage.

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RT0805BRD07453KL Overview

Use the download button to access the RT0805BRD07453KL schematic symbol, PCB footprint, and 3D model.
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