The recommended land pattern for RT0805BRD0751KL is a rectangular pad with a size of 0.8mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's termination style and ensure good solder joint reliability.
RT0805BRD0751KL has a maximum operating temperature of 150°C, making it suitable for most industrial and commercial applications. However, it's essential to ensure that the component is not exposed to temperatures above the recommended maximum rating to prevent degradation or failure.
To prevent damage during assembly, handle RT0805BRD0751KL by the edges or the body, avoiding touching the terminations. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component.
The recommended soldering profile for RT0805BRD0751KL is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be optimized to prevent overheating, which can cause damage to the component or the PCB.
Yes, RT0805BRD0751KL is compatible with lead-free soldering processes. The component is designed to meet the requirements of RoHS (Restriction of Hazardous Substances) and is suitable for use with lead-free solders.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
RT0805BRD0751KL Overview
Use the download button to access the RT0805BRD0751KL schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like RT080,
or try a keyword search, such as Thin Film Resistors
