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RT0805DRD071K8L - Yageo Group

Description: Thin Film Resistors - SMD

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RT0805DRD071K8L - Yageo Group - PCB symbol
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RT0805DRD071K8L - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - RT0805
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RT0805DRD071K8L - Yageo Group - 3D model - Resistor Chip - RT0805
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RT0805DRD071K8L Details

  • Manufacturer Part Number:

    RT0805DRD071K8L

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    14

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Resistance:

    1800 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.5%

  • Working Voltage:

    150 V

RT0805DRD071K8L Frequently Asked Questions (FAQs)

  • The recommended land pattern for RT0805DRD071K8L is a rectangular pad with a size of 0.8mm x 0.5mm, with a solder mask clearance of 0.1mm. The land pattern should be designed to accommodate the component's termination resistance and to ensure reliable connections.
  • RT0805DRD071K8L is a moisture-sensitive device (MSD) and requires special handling and storage procedures to prevent damage. The component should be stored in a dry environment with a relative humidity of less than 30% and a temperature range of 20°C to 30°C. Before reflow soldering, the component should be baked at 125°C for 24 hours to remove any absorbed moisture.
  • The maximum allowable voltage derating for RT0805DRD071K8L is 80% of the rated voltage. This means that if the component is rated for 50V, the maximum allowable voltage derating would be 40V.
  • To ensure the component's reliability in high-temperature applications, it is recommended to follow the recommended derating curves provided in the datasheet. Additionally, the component should be mounted on a PCB with a high thermal conductivity to dissipate heat efficiently.
  • RT0805DRD071K8L has a tolerance to pulse voltage changes, but the exact tolerance depends on the specific application and operating conditions. It is recommended to consult with the manufacturer or a qualified engineer to determine the component's tolerance to pulse voltage in a specific application.

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RT0805DRD071K8L Overview

Use the download button to access the RT0805DRD071K8L schematic symbol, PCB footprint, and 3D model.
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