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RT0805DRE07182KL - Yageo Group

Description: Thin Film Resistors - SMD 182K OHM .5% 50PPM

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RT0805DRE07182KL - Yageo Group - PCB symbol
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PCB Footprints
RT0805DRE07182KL - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - RT0805
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RT0805DRE07182KL - Yageo Group - 3D model - Resistor Chip - RT0805
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RT0805DRE07182KL Details

  • Manufacturer Part Number:

    RT0805DRE07182KL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    12

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Resistance:

    182000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.5%

  • Working Voltage:

    150 V

RT0805DRE07182KL Frequently Asked Questions (FAQs)

  • The recommended land pattern for RT0805DRE07182KL is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's dimensions and tolerances.
  • RT0805DRE07182KL has a rated operating temperature range of -55°C to 125°C. While it can tolerate high temperatures, it's essential to consider the derating curve and ensure the component is used within its specified temperature range to maintain reliability and performance.
  • RT0805DRE07182KL is a moisture-sensitive device (MSD) with a MSL (Moisture Sensitivity Level) rating of 3. It's essential to follow proper handling and storage procedures, such as storing the components in a dry environment, using desiccant packaging, and baking the components before reflow soldering.
  • The recommended soldering profile for RT0805DRE07182KL is a reflow soldering process with a peak temperature of 260°C ± 5°C, and a dwell time above 220°C of 20-30 seconds. The soldering process should be optimized to prevent thermal shock and ensure reliable connections.
  • RT0805DRE07182KL is a surface-mount device designed for general-purpose applications. While it can tolerate some vibration and shock, it's essential to consider the component's mechanical stress limits and ensure the PCB design and assembly process can withstand the expected environmental conditions.

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RT0805DRE07182KL Overview

Use the download button to access the RT0805DRE07182KL schematic symbol, PCB footprint, and 3D model.
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