The recommended land pattern for RT0805FRE0739RL is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape.
Yes, RT0805FRE0739RL is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the component's reliability and lifespan may be affected by prolonged exposure to high temperatures.
Yes, RT0805FRE0739RL is compatible with lead-free soldering processes, including RoHS and WEEE compliant soldering processes.
The MSL of RT0805FRE0739RL is MSL 2, which means it can withstand exposure to moisture for up to 4 days at 30°C and 60% relative humidity without requiring baking before reflow soldering.
Yes, RT0805FRE0739RL is designed to withstand high-vibration and high-shock environments, making it suitable for use in applications such as automotive, aerospace, and industrial control systems.
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RT0805FRE0739RL Overview
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