The recommended land pattern for RT0805FRE07620RL is a rectangular pad with a size of 0.8mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's termination style and ensure good solder joint reliability.
RT0805FRE07620RL is rated for operation up to 150°C, but it's recommended to derate the component's power rating and consider the application's thermal management when operating at high temperatures. Consult YAGEO's application notes for more information.
RT0805FRE07620RL is a moisture-sensitive device (MSD) and requires proper handling and storage to prevent damage. Follow YAGEO's recommended storage and handling procedures, and ensure the component is baked according to the datasheet's instructions before reflow soldering.
The recommended soldering profile for RT0805FRE07620RL is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a ramp rate of 3°C/second. Consult YAGEO's application notes for more detailed information.
RT0805FRE07620RL is designed for general-purpose use and may not be suitable for high-vibration or high-shock applications. Consult YAGEO's application notes and perform thorough testing to ensure the component's reliability in such environments.
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RT0805FRE07620RL Overview
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