The recommended land pattern for RT0805FRE1010KL is a rectangular pad with a size of 0.8mm x 1.05mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's dimensions and tolerances.
To handle thermal stress during reflow soldering, it is recommended to follow the recommended reflow profile provided by YAGEO Corporation, which includes a peak temperature of 260°C and a dwell time of 20-30 seconds. Additionally, ensure that the PCB is designed with adequate thermal relief and that the component is properly secured to the board.
The MSL of RT0805FRE1010KL is MSL 2, which means that the component can withstand a maximum of 24 hours of exposure to a humidity level of 60% at 30°C before reflow soldering.
Yes, RT0805FRE1010KL is suitable for high-frequency applications up to 1 GHz. However, it is recommended to consult with YAGEO Corporation's application notes and simulation tools to ensure that the component meets the specific requirements of your application.
To ensure the reliability of RT0805FRE1010KL in a harsh environment, it is recommended to follow YAGEO Corporation's guidelines for environmental testing, including temperature cycling, humidity testing, and vibration testing. Additionally, ensure that the component is properly soldered and secured to the board, and that the PCB is designed with adequate thermal relief and moisture protection.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
RT0805FRE1010KL Overview
Use the download button to access the RT0805FRE1010KL schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like RT080,
or try a keyword search, such as Fixed Resistors
