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RT0805FRE1322KL - Yageo Group

Description: Res Thin Film 0805 22K Ohm 1% 0.125W(1/8W) ±50ppm/°C Pad SMD T/R

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RT0805FRE1322KL - Yageo Group - PCB symbol
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PCB Footprints
RT0805FRE1322KL - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - 0805 (2012 Metric)
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3D Models
RT0805FRE1322KL - Yageo Group - 3D model - Resistor Chip - 0805 (2012 Metric)
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RT0805FRE1322KL Details

  • Manufacturer Part Number:

    RT0805FRE1322KL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    12

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Paper, 13 Inch

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Resistance:

    22000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

RT0805FRE1322KL Frequently Asked Questions (FAQs)

  • The recommended land pattern for RT0805FRE1322KL is a rectangular pad with a size of 0.8mm x 0.5mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to ensure good solderability and to prevent solder bridging.
  • RT0805FRE1322KL is rated for operation up to 150°C, but it's not recommended for use in high-temperature applications above 125°C without derating. The component's reliability and performance may be affected at higher temperatures.
  • Yes, RT0805FRE1322KL is compatible with lead-free soldering processes. YAGEO Corporation uses a lead-free termination finish that meets the requirements of the RoHS directive.
  • The MSL of RT0805FRE1322KL is MSL 2, which means it can withstand exposure to moisture for up to 4 days at 30°C and 60% relative humidity without being baked prior to reflow soldering.
  • RT0805FRE1322KL is designed to operate in environments with relative humidity up to 80%. However, it's recommended to take precautions to prevent moisture ingress and to ensure proper sealing and encapsulation in high-humidity applications.

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RT0805FRE1322KL Overview

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Part Image 239040172203L YAGEO Corporation

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For a full list of alternate parts for RT0805FRE1322KL, check out Findchips.com