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RT1206FRE073KL - Yageo Group

Description: Halogen Free Epoxy RoHS compliant Reducing environmentally hazardous wastes High component and equipment reliability Saving of PCB space None forbidden-materials used in products/production

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RT1206FRE073KL - Yageo Group PCB footprint - Resistor Chip - Resistor Chip - RT1206
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RT1206FRE073KL - Yageo Group  - 3D model - Resistor Chip - RT1206
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RT1206FRE073KL Details

  • Manufacturer Part Number:

    RT1206FRE073KL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    12

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.55 mm

  • Package Length:

    3.1 mm

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, Paper, 7 Inch

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Resistance:

    3000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

RT1206FRE073KL Frequently Asked Questions (FAQs)

  • The recommended land pattern for RT1206FRE073KL is a rectangular pad with a size of 1.3mm x 1.6mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal stress, it is recommended to follow the recommended reflow soldering profile, which includes a peak temperature of 260°C and a dwell time of 20-30 seconds above 220°C. Additionally, ensure that the PCB is designed with adequate thermal relief and that the component is properly anchored to the board.
  • The MSL of RT1206FRE073KL is level 2, which means that the component can withstand a maximum exposure of 4 days at 30°C and 60% relative humidity before reflow soldering.
  • Yes, RT1206FRE073KL is suitable for high-frequency applications up to 1 GHz. However, it is recommended to consult the impedance characteristics and self-resonance frequency in the datasheet to ensure that the component meets the specific requirements of your application.
  • To ensure reliability, it is recommended to follow the recommended storage and handling procedures, and to operate the component within the specified temperature and humidity ranges. Additionally, consider using a conformal coating or potting compound to protect the component from environmental stressors.

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RT1206FRE073KL Overview

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