- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for RT1206FRE07560KL
- Part Number RT1206FRE07560KL
- Manufacturer Yageo Group
- Pin Count 2
- Part Category Resistor
- Package Category Resistor Chip
- Footprint Name Resistor Chip - RT1206
- Released Date Mar 7, 2021
- Last Modified Date Jan 26, 2026 1:55 PM UTC
- Pinout / Pin List Click Here (Member Only)
RT1206FRE07560KL Details
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Manufacturer Part Number:
RT1206FRE07560KL
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Reach Compliance Code:
Compliant
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Country Of Origin:
Mainland China, Taiwan
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ECCN Code:
EAR99
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HTS Code:
8533.21.00.30
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Factory Lead Time:
16 Weeks
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Manufacturer:
YAGEO Corporation
RT1206FRE07560KL Frequently Asked Questions (FAQs)
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The recommended land pattern for RT1206FRE07560KL is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The land pattern should be designed to accommodate the component's termination style and ensure good solder joint reliability.
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To handle thermal management of RT1206FRE07560KL, ensure good thermal conduction by using a thermal pad or a heat sink, and provide adequate airflow around the component. The component's thermal resistance (Rth) is 350°C/W, so it's essential to design a thermal management system that can keep the component's temperature within the recommended operating range.
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The moisture sensitivity level (MSL) of RT1206FRE07560KL is MSL 2, which means it can withstand a maximum of 24 hours of exposure to moisture before soldering. It's essential to follow proper storage and handling procedures to prevent moisture absorption and ensure reliable soldering.
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Yes, RT1206FRE07560KL is suitable for high-frequency applications up to 1 GHz. However, it's essential to consider the component's self-resonant frequency (SRF) and ensure that it does not resonate at the operating frequency. Additionally, the component's parasitic inductance and capacitance should be considered in the circuit design.
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To ensure the reliability of RT1206FRE07560KL in a harsh environment, follow proper design and manufacturing guidelines, such as using a robust PCB design, selecting a suitable soldering process, and ensuring adequate cleaning and drying of the component. Additionally, consider using a conformal coating or potting compound to protect the component from environmental stresses.
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RT1206FRE07560KL Overview
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