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RT8105GS - RICHTEK

Description: IC REG CTRLR BUCK 8SOP

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RT8105GS - RICHTEK PCB footprint - Small Outline Packages - Small Outline Packages - 8 lead sop
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RT8105GS - RICHTEK  - 3D model - Small Outline Packages - 8 lead sop
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RT8105GS Details

  • Manufacturer Part Number:

    RT8105GS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOP-8

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    8SOP

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Richtek Technology Corp

  • YTEOL:

    0

  • Additional Feature:

    IT ALSO OPERATES AT 12 V SUPPLY

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.25 V

  • Input Voltage-Min:

    4.75 V

  • Input Voltage-Nom:

    5 V

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9025 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    1.753 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Temperature Grade:

    OTHER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3.899 mm

RT8105GS Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output capacitors close to the IC, and use short and wide traces for the power lines.
  • Monitor the input voltage, output current, and junction temperature to ensure they are within the specified limits. Use thermal design and layout techniques to keep the junction temperature below 125°C.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended. The capacitor should be placed close to the VIN pin and have a low impedance path to the ground plane.
  • Choose an output capacitor with a low ESR and a value of 10uF to 47uF. The capacitor should be placed close to the VOUT pin and have a low impedance path to the ground plane.
  • Use a thermal pad on the PCB to connect the IC's thermal pad to a solid ground plane. Ensure good airflow around the IC and use a heat sink if necessary.

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RT8105GS Overview

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