TDK-Lambda recommends a multi-layer PCB with a solid ground plane, and thermal vias under the module to dissipate heat. A minimum of 1 oz copper thickness is recommended. Additionally, a thermal interface material (TIM) should be used between the module and the heat sink to ensure good thermal conductivity.
To ensure EMC, TDK-Lambda recommends using a metal enclosure, and applying EMI filtering and shielding techniques. The module's input and output cables should be properly routed and shielded, and the system should be designed to meet the relevant EMC standards (e.g., EN 55022, CISPR 22).
The derating curve for the RTEN-5010 is typically provided by TDK-Lambda upon request. The curve shows the reduction in output power as a function of temperature, altitude, and input voltage. Engineers should consult the derating curve to ensure the module operates within its specified ratings and to avoid overheating or overvoltage conditions.
Yes, the RTEN-5010 can be used in a redundant or parallel configuration to achieve higher power or redundancy. However, engineers should ensure that the modules are properly synchronized and configured to avoid oscillations or instability. TDK-Lambda recommends consulting their application notes and technical support for guidance on implementing redundant or parallel configurations.
TDK-Lambda recommends using low-ESR capacitors with a minimum capacitance of 10uF for the input and output filters. The capacitors should be rated for the maximum input and output voltages, and should be placed as close as possible to the module's input and output pins.
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RTEN-5010 Overview
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