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RTS3L012 - TE Connectivity

Description: SPST (AgSnO2) hi-inrush relay,16A 12Vdc

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PCB Footprints
RTS3L012 - TE Connectivity PCB footprint - Other - Other - RTS3L012-1
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3D Models
RTS3L012 - TE Connectivity  - 3D model - Other - RTS3L012-1
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RTS3L012 Details

  • Manufacturer Part Number:

    RTS3L012

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    37 Weeks

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    7

  • Body Breadth:

    12.7 mm

  • Body Height:

    16 mm

  • Body Length or Diameter:

    29 mm

  • Coil Current(DC)-Max:

    0.033 A

  • Coil Operate Voltage(DC):

    8.4 V

  • Coil Power:

    400 mW

  • Coil Release Voltage(DC):

    1.2 V

  • Coil Resistance:

    360 Ω

  • Coil Voltage(DC)-Max:

    12 V

  • Coil Voltage-Nom:

    12 V

  • Coil/Input Supply Type:

    DC

  • Contact (AC) Max Power Rating R Load:

    4000VA@400VAC

  • Contact (AC) Max Rating R Load:

    16A@250VAC

  • Contact Current(AC)-Max:

    16 A

  • Contact Current(DC)-Max:

    16 A

  • Contact Voltage(AC)-Max:

    400 V

  • Contact/Output Supply Type:

    AC

  • Dielectric Strength Between Coil and Contacts:

    5000 Vrms

  • Dielectric Strength Between Open Contacts:

    1250 Vrms

  • Electrical Life:

    50000 Cycle(s)

  • End Contact Material:

    SILVER TIN OXIDE

  • Input Switching Control Type:

    Random

  • Mounting Feature:

    PANEL MOUNT

  • Number of Terminals:

    7

  • Operate Time:

    14 ms

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Packing Method:

    BOX; TUBE

  • Physical Dimension:

    29mm x 12.7mm x 16mm

  • Reference Standard:

    CSA; CUL; UL; VDE

  • Relay Action:

    MOMENTARY

  • Relay Form:

    1 FORM A

  • Relay Function:

    SPST

  • Relay Type:

    POWER/SIGNAL RELAY

  • Release Time:

    9 ms

  • Sealing:

    RT2

  • Surface Mount:

    NO

  • Terminal Length:

    0.003500127000254001 inch

  • Termination Type:

    SOLDER/QUICK CONNECT

  • Weight:

    14 g

RTS3L012 Frequently Asked Questions (FAQs)

  • TE Connectivity provides a recommended PCB layout and land pattern in their application note AN-1043, which can be found on their website. It's essential to follow this layout to ensure proper thermal management and signal integrity.
  • To ensure reliable connections, follow the recommended soldering profile and handling procedures outlined in the datasheet. Use a soldering iron with a temperature-controlled tip, and avoid applying excessive force or bending the leads during assembly.
  • The RTS3L012 has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to ensure optimal heat dissipation. A thermal interface material (TIM) can be used to improve thermal conductivity. Additionally, ensure good airflow around the device and avoid blocking the airflow with nearby components.
  • While the RTS3L012 is a robust device, it's essential to evaluate its suitability for high-vibration or high-shock environments. TE Connectivity provides guidance on vibration and shock testing in their application note AN-1043. Additionally, consider using additional mechanical support or potting the device to ensure reliability in harsh environments.
  • To troubleshoot issues with RTS3L012, start by reviewing the datasheet and application notes to ensure proper usage and assembly. Check for soldering defects, incorrect component orientation, or inadequate thermal management. Use oscilloscopes or logic analyzers to debug signal integrity issues. If the problem persists, contact TE Connectivity's technical support for further assistance.

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RTS3L012 Overview

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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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